Modern manufacturing increasingly relies on smart components that can sense, monitor and adapt in real time. Yet many of the microelectronic devices that enable this intelligence cannot withstand the extreme heat involved in metal additive manufacturing. Embedding them beneath functional metal surfaces has therefore remained a major challenge. High temperatures, molten powder and mechanical stress can damage delicate structures long before the component enters service.

A new approach to integration

Laser metal deposition (LMD) provides accurate material build-up on existing metal parts, but its thermal intensity poses clear risks for electronics. The study explores whether custom-made photodiodes can be fully enclosed within metal using LMD without additional thermal protection. Drawing on earlier fibre embedding methods, the approach creates a dedicated slot for the device, shields it with a metal strip and encapsulates it through controlled powder deposition.

What the experiments show

The results demonstrate that the photodiode can survive the embedding process and remain light-sensitive, albeit with a reduced electrical response. Microscopy reveals burn marks caused by heated powder entering small gaps in the protective setup, highlighting the need for improved barrier design. Electrical measurements indicate that thermal stress and possible contamination affect material behaviour and contact resistance, yet the device still functions as a photodiode after encapsulation.

Paving the way for smart metal components

The study shows that embedding microelectronics directly into metal parts is feasible and offers clear potential for future smart tooling, structural monitoring and high-performance applications. Further progress will depend on better thermal management, refined shielding concepts and tighter control over deposition parameters.

This article is based on the peer-reviewed publication “Embedding Electronics Inside Metal with Laser Metal Deposition”, published in Procedia CIRP (2025).